LONG Zhili
Address:
HITSGS ,D202O, Shenzhen University Town, Xili,Shenzhen,China (518055)
Email:
longworking@163.com
Phone:
+86-755-26033788
+86-755-26033588(Fax)
PERSONAL PROFILE
 
RESEARCH INTEREST
 
Motion control system of automatic equipment;
Dynamics and vibration control of mechanical system;
Design and control of piezoelectric device and ultrasonic system;
Embedded system;
Ultrasonic image processing.
EDUCATION  
2000-2007
PHD Degree of Mechatronic Engineering, Central South University, China
Thesis: Dynamic Characteristics and Optimization of Ultrasonic Transduction System for Chip Packaging.
1996-2000
Bachelor Degree of Mechanical Engineering and Automation, Central South University of Technology, China.
Thesis: Software System for Moulding Design Based Parameter
RESEARCH & WORK EXPERIENCE  
2011-
Associate Professor, Master Supervisor. School of Mechanical Engineering and Automation, Harbin Institute of Technology Shenzhen Graduate School
2009-2011
Associate Professor, Mechanical Engineering School, Central South University.
2007-2009
ASM Singapore Technology
2002-2007
Teaching Assistant, Lecturer, School of Mechanical Engineering, Central South University.
PROFESSIONAL QUALIFICATION & ACADEMIC SERVICE
 
2012-
IEEE Member
RESEARCH PROJECTS
2012-2015
NSFC Major Project: Design and Control Science of Motion with High Speed and High Precision Platform for Microelectronics Manufacturing( U1134004)
2012-2014
Harbin Institute of Technology Innovation Funding Project: Model Computation and Application of ** Ultrasonic System( HIT.NSRIF. 2013099)
2011-2013
GuangDong Province Major Project: Research on High Efficient Heat Dissipation and Back Bonding of High Power Chip New Technology.(2011A080801004)
2012-2014
ShenZhen Fundamental Research Project: Computation and Optimization of High Power Heat Dissipation Model Technology for ** Field.
2011-2013
ShenZhen Fundamental Research Project: Modeling and Optimization of Ultrasonic System Dynamics in** Field.
RESEARCH ACHIEVEMENT & AWARDS
2008
Provincial Technology Progress Award First Class
PATENT
   
Experimental Platform of Packaging, Number: CN200610031493, Date of Authorizing: Oct 3rd 2006
PAPER & BOOK PUBLICATIONS
1)Dynamics of Ultrasonic Transducer System in Thermosonic Flip Chip Bonding,IEEE Components and Packaging Technology, Vol.41, No. 2, pp. 261-267, 2009.
2)Study of Temperature Parameter in Au-Ag Wire Bonding,IEEE Transaction on Electronics Packaging Manufacturing, Vol. 31, No. 3, pp. 221-226, 2008
3)Structural Optimization of Ultrasonic Transducer based on Frequency Sensitivity, China Mechanical Engineering, Vol. 23, No. 4, pp. 439-442, 2012.
4)Basic Piezoelectric Materials Leading Wire Clamp Holder, Piezoelectrics and Acoustooptics, Vol. 34, No. 6, pp. 853-856, 2012
5)Impedance Characteristics of Ultrasonic Back Bonding Transduction System on Operating Conditions, Piezoelectrics and Acoustooptics, Vol. 32, No. 6, pp. 1062-1065, 2010.
6)Impedance Admittance Model of Heat Ultrasonic Back Bonding Transduction System, Chinese Journal of Mechanical Engineering, Vol. 43, No. 10, pp. 14-20, 2007.
7)Effect Analysis of Chip Bonding Transduction System in Contact Interface, Piezoelectrics and Acoustooptics, Vol. 30, No. 4, pp. 551-553, 2008.
8)Multi-Modes Vibration and Finite Element Analysis of Heat Ultrasonic Back Bonding Transduction System, Chinese Journal of Electronics, Vol. 2, No. 36, pp. 23-26, 2008.
9)Temperature Effect on Joint Strength in Heat Ultrasonic Bonding Technology, Transactions of The China Welding Institution, Vol. 26, No. 8, pp. 23-26, 2005.
10)Multi-Modes Analysis of Heat Ultrasonic Back Bonding Transduction System, Transactions of The China Welding Institution, Vol. 27, No. 12, pp. 21-24, 2006.
11)Research on Impedance and Power Dynamics Characteristics of Heat Ultrasonic Bonding PZT, Chinese Journal of Mechanical Engineering, Vol. 17, No. 4, pp. 293-400, 2006.
12)Research on Vibration Simulation Characteristics of Heat Ultrasonic Head Wire Bonding Transduction System, Chinese Journal of Mechanical Engineering, Vol. 17, No. 15, pp. 1613-1616, 2006.
CONFERENCE PAPERS/TALKS
 
1)Long Zhili, Wu Yunxin, Han Lei, Zhong Jue, Effect of Contact Interface in Transducer System in Ultrasonic Bonding, The 9th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP07). June 27-30, 2007, Shanghai, 287-290
2)Long zhili, Wu Yunxin,Zhong jue. Vibration Charactersistics of Ultrasonic Transducer in Thermosonic Flip Chip Bonding. 8th Internation Conferece on Electronics Packaging Technology, 2007, Shanghai, China. P47-52.
3)LONG Zhili,WU YunXin,HAN Lei. Measurement of Driving Electric Signal and Input Impedance Analysis of PZT Transducer in Thermosonic Bonding. The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04) June 30-July 3,2004. 322-325.
4)Long zhili, Wu Yunxin, Han Lei, Zhong Jue. Joint Time-Frequency Analysis of Capillary Tip Vibration in Thermosonic Wire Bonding, The 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), 27-29th June, 2005,460-465.
5)Long zhili, Han Lei, Wu Yunxin, Zhou Hongquan, Zhong Jue. Vibration Simulation of Transducer System in Thermosonic Wire Bonding, The 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), 27-29th June, 2005, 419-425.
6)Long Zhili, Han Lei, Wu Yunxin, Zhong Jue. Effect of Bonding Pressure on Transducer Ultrasonic Propagation in Thermosonic Flip Chip Bonding, The 8th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP06), 28-30th June, 2006, 181-187
7)Long zhili, Wu Yunxin,Han Lei. Effect of Contact interface in transducer system in ultrasonic bonding. The 9th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP07), 28-30th June, 2007, 287-290
TEACHING/SUPERVISING EXPERIENCE
Teaching: School of Mechanical Engineering and Automation, Harbin Institute of Technology Shenzhen Graduate School
2011,2012,2013: Vibration Control
SUPERVISING EXPERIENCE
2010:4
2011:5
2012:6
Updated:2018-05