JI Hongjun
Address:
HIT Campus, Shenzhen University Town, Xili, Shenzhen, China (518055)
Email:
jhj7005@hit.edu.cn
Phone:
+86-755-26033281
+86-755-26033504(Fax)
PERSONAL PROFILE
 
RESEARCH INTEREST
 
1. Ultrasound processing technologies, including ultrasonic-assisted casting and joining (welding, soldering and brazing etc.), ultrasonic-induced deformation in materials, and non-destructive testing by ultrasound (ultrasonic scaning, C-SAM)

2. Surfacial and interfacial microstructures and their properties based on electron microscopy, SEM and TEM etc.

3. Joining technologies for new materials, materials with high or special performances, carbides, ceramics, high strength alloys, metallic glasses and nanostructured materials

4. Interconnection materials and technologies for advanced electronic packaging, wire bonding, die bonding etc.

5. Wearable, flexible electronics, synthesize nano metal particles, nanowires, and their core-shell structures, printed patterns and sensors/devices
EDUCATION  
2005-2008
D.E. in materials processing enineering, Harbin Institute of Technology, China
2003-2005
M.E.Sc. in materials processing enineering, Harbin Institute of Technology, China
1999-2003
B.E. in materials processing enineering, Harbin Institute of Technology, China
RESEARCH & WORK EXPERIENCE  
2012-present
Associate Professor. School of Materials Science and Engineering, Harbin Institute of Technology Shenzhen Graduate School
2010.03
Visiting Scholar, National Institute for Materials Science, Japan
2009-2012
Assistant Professor, School of Materials Science and Engineering, Harbin Institute of Technology Shenzhen Graduate School.
2008-2009
NIMS Postdoctoral Researcher, National Institute for Materials Science, Japan
PROFESSIONAL QUALIFICATION & ACADEMIC SERVICE
 
RESEARCH PROJECTS
2011-2013
NSFC Project:[Ultrasonic-induced deformation twinning in pure coarse-grained aluminum wire observed by TEM] [51005057]
2012-2014
The Project-sponsored by SRF for ROCS, SEM Project:[Deformation mechanism of pure aluminum micro-sized wire under ultrasound irradiation]
2011-2013
The Key Laboratory upgrade plan in Shenzhen Project:[Common technologies for joining new materials by ultrasonic methods][CXB201105100075A]
2011-2013
Peacock Plan Project:[Key Technology and its application for ultrasonically joinging bulk metallic glass and nanosized materials][KQC201105300005A]
RESEARCH ACHIEVEMENT & AWARDS
2011
Peakcock Plan in Shenzhen
PATENT
   
PAPER & BOOK PUBLICATIONS
Refereed papers:

ResearcherID: K-1107-2013
ORCID:http://orcid.org/0000-0002-4159-6838

33. Hongjun Ji, Junbo Zhou,Meng Liang, Huajun Lu,Mingyu Li,Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging, Ultrasonics Sonochemistry, 2018, 41: 375-381.
https://doi.org/10.1016/j.ultsonch.2017.10.003

32. Hongjun Ji, Hao Chen, Mingyu Li, Overwhelming reaction enhanced by ultrasonics during brazing of alumina to copper in air by Zn-14Al hypereutectic filler, Ultrasonics Sonochemistry, 2017, 35: 61-71.
https://doi.org/10.1016/j.ultsonch.2016.09.003

31. Hongjun Ji, Hao Chen, Mingyu Li, Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina, Ultrasonics Sonochemistry, 2017, 34: 491-495.
http://dx.doi.org/10.1016/j.ultsonch.2016.06.031

30. C. Zhang, S. Pei, H. Ji, Y. Cui and M. Li, Fabrication of Ni60–SiC coating on carbon steel for improving friction, corrosion properties, Materials Science and Technology, 2017, 33: 446-453.
http://dx.doi.org/10.1080/02670836.2016.1224216

29. Hongjun Ji, Jiao Wang, Mingyu Li, Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging, Microelectronics Reliability, 2016, 66: 134-142.
http://dx.doi.org/10.1016/j.microrel.2016.10.003

28. Jingdong Liu,Hongtao Chen, Hongjun Ji, Mingyu Li, Highly Conductive Cu?Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles, ACS Applied Materials and Interfaces, 2016, 8: 33289-33298.
http://pubs.acs.org/doi/10.1021/acsami.6b10280

27. Jingdong Liu, Hongjun Ji, Shuai Wang, Mingyu Li, The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink, Journal of Materials Science: Materials in Electronics, 2016, 27: 13280-13287.
https://link.springer.com/content/pdf/10.1007%2Fs10854-016-5476-3.pdf

26. Hongjun Ji, Xiao Cheng, Mingyu Li, Ultrafast ultrasonic-assisted joining of bare α-alumina ceramics through reaction wetting by aluminum filler in air, Journal of the European Ceramic Society, 2016, 36: 4339-4344.
http://dx.doi.org/10.1016/j.jeurceramsoc.2016.06.028

25. Hongjun Ji, Minggang Li, Shu Ma, Mingyu Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Materials and Design, 2016, 108: 590-596.
http://dx.doi.org/10.1016/j.matdes.2016.07.027

24. Ming Yang, Hongjun Ji, Shuai Wang, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering, Journal of Alloys and Compounds, 2016, 679: 18-25.
http://dx.doi.org/10.1016/j.jallcom.2016.03.177

23. Ming Yang, Shihua Yang, Hongjun Ji, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method, Journal of Materials Processing Technology 2016, 236: 84-92.
http://dx.doi.org/doi:10.1016/j.jmatprotec.2016.04.019

22. Hongjun Ji, Yufei Qiao, Mingyu Li, Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application. Scripta Materialia 2016, 110: 19-23.
http://dx.doi.org/10.1016/j.scriptamat.2015.07.036

21. Hongjun Ji, Qiang Wang, Mingyu Li, Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering. Journal of Electronic Materials 2016, 45: 88-97.
https://doi.org/10.1007/s11664-015-4108-7

20. Hongjun Ji, Yuyou Ma, Mingyu Li,Chunqing Wang,Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering,Journal of Electronic Materials 2015, 44: 733-743.
http://dx.doi.org/10.1007/s11664-014-3516-4

19. Hongjun Ji, Long Li, Mingyu Li, Low-temperature joining of Fe-based amorphous foil with aluminum by ultrasonic-assisted soldering with Sn-based fillers. Materials and Design 2015, 84: 254-260.
http://dx.doi.org/10.1016/j.matdes.2015.06.112

18. Hongjun Ji, Long Li, Lijie Wang, Mingyu Li, Microstructures and properties of the Fe-based amorphous foil/aluminum dissimilar joint by ultrasonic-assited soldering. Welding in the World 2015, 59: 623-628.
http://dx.doi.org/10.1007/s40194-015-0237-0

17. Hongjun Ji, Junzhao Wanga, Mingyu Li, Evolution of the bulk microstructure in 1100 aluminum builds fabricated by ultrasonic metal welding. Journal of Materials Processing Technology 2014, 214: 175-182.
http://dx.doi.org/10.1016/j.jmatprotec.2013.09.005

16. Hongjun Ji, Shuai Wang, MingyuLi, Jongmyung Kim. Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles. Materials Letters 2014, 116: 219-222.
http://dx.doi.org/10.1016/j.matlet.2013.11.030

15. Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang.Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification.Journal of Electronic Materials 2014, 43: 2467-2478.
http://dx.doi.org/10.1007/s11664-014-3113-6

14. YongXiao, HongjunJi, MingyuLi, Jongmyung Kim. Ultrasound-induced equiaxial ower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint. Materials Science & Engineering A 2014, 594: 135-139.
http://dx.doi.org/10.1016/j.msea.2013.11.063

13. Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang. Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn–3.0Ag–0.5Cu alloy. Journal of Materials Processing Technology 2014, 214: 13-20.
http://dx.doi.org/10.1016/j.jmatprotec.2013.07.013

12. Yong Xiao, Hongjun Ji, Mingyu Li, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design 2013, 52: 740-747.
http://dx.doi.org/10.1016/j.matdes.2013.06.016

11. Shuai Wang, Mingyu Li, Hongjun Ji. Chunqing Wang. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Materialia 2013, 69: 789-792.
http://dx.doi.org/10.1016/j.scriptamat.2013.08.031

10.Yong Xiao, Hongjun Ji, Mingyu Lia, etc. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal. Materials & Design 2013, 47: 717–724.
http://dx.doi.org/10.1016/j.matdes.2013.01.004

9. Hongjun Ji, Mingyu Li, Yongfei Lu, Chunqing Wang. Mechanical properties and microstructures of hybrid ultrasonic resistance brazing of WC-Co/BeCu, J. Mater. Process. Technol. 2012, 212:1885-1891.
http://dx.doi.org/10.1016/j.jmatprotec.2012.04.012

8. Shuai Wang, Hongjun Ji, Mingyu Li, Chunqing Wang, Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles, Mater. Let. 2012, 85:61-63.
http://dx.doi.org/10.1016/j.matlet.2012.06.089

7. Hongjun Ji, Mingyu Li, etc, In situ Measurement of Bond Resistance Varying with Process Parameters during Ultrasonic Wedge Bonding. J. Mater. Process. Technol. 2009, 209(1): 139-144.
http://dx.doi.org/10.1016/j.jmatprotec.2008.01.036

6. Hongjun Ji, Mingyu Li, etc, Nano Features of Al/Au Ultrasonic Bond Interface Observed by High Resolution Transmission Electron Microscope. Mater. Character. 2008, 59: 1419-1424.
http://dx.doi.org/10.1016/j.matchar.2008.01.001

5. Heeseon Bang, Hongjun Ji, Mingyu Li, etc. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. Mater. Sci. Forum. 2008, 580-582: 173-176.

4. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Comparison of Interface Evolution of Ultrasonic Aluminum and Gold Wire Wedge Bonds during Thermal Aging. Mater. Sci. Eng. A. 2007,447 (1-2): 111-118.
http://dx.doi.org/10.1016/j.msea.2006.10.105

3. Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Evolution of the Bond Interface during Ultrasonic Al–Si Wire Wedge Bonding Process. J. Mater. Process. Technol. 2007,182 (1-3):202-206.
http://dx.doi.org/10.1016/j.jmatprotec.2006.07.033

2. Mingyu Li , Hongjun Ji, Chunqing Wang, etc. Interdiffusion of Al–Ni System Enhanced by Ultrasonic Vibration at Ambient Temperature. Ultrasonics. 2006, 45(1-4): 61-65.
http://dx.doi.org/10.1016/j.ultras.2006.06.058

1. Mingyu Li, Hongjun Ji, Chunqing Wang, etc. Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding. J. Mater. Sci. Technol. 2006, 22(4): 483-486.
https://doi.org/10.1016/j.jmatprotec.2006.07.033
CONFERENCE PAPERS/TALKS
 
TEACHING/SUPERVISING EXPERIENCE
Updated:2018-09