CHEN Hongtao
Address:
302A, D building, Campus of Harbin Institue of Technology, Shenzhen University Town (深圳西丽大学城哈工大校区D栋302A)
Email:
chenht@hit.edu.cn
Phone:
0755-26033073
PERSONAL PROFILE
 
RESEARCH INTEREST
 
Solder interconnect reliability; Interfacial reactions; Advanced packaging materials
EDUCATION  
2003.9-2007.7
Ph.D. in Materials processing engineering, Harbin Institue of Technology
2001.9-2003.9
Master in Materials processing engineering, Harbin Institue of Technology
1994.9-1998.7
Bachelor in Heat treatment of metals, Jiamusi Institue of Technology
RESEARCH & WORK EXPERIENCE  
2006, 1-2006, 7
Visiting scholar of University of Sydney, supervised by Dr. Cheng Yan, Australia.
2008, 1-2009, 1
Postdoc in Electronics production technology Lab of Helsinki University of Technology, supervised by Prof. Jorma Kivilahti, a leading scientist in electronic packaging field, Finland.
PROFESSIONAL QUALIFICATION & ACADEMIC SERVICE
 
RESEARCH PROJECTS
2013.01-2014.12
Shenzhen Special Funds for Overseas High-level Talents
2013.01-2014.09
Shenzhen Special Funds for Strategic Emerging Industries
2013.03-2014.06
collaborative project with YIK SHING TAT Industrial Corporation
RESEARCH ACHIEVEMENT & AWARDS
PATENT
   
PAPER & BOOK PUBLICATIONS
1. J. Han, H.T. Chen, M.Y. Li, Shear deformation behaviors of Sn3.5Ag lead-free solder samples, Journal of Materials Science and Technology, online 25 January 2013.
2. J.Y. Xu,H.T. Chen*,M.Y. Li,Study of lead-free solder interconnect reliability based on grain orientation,Acta Metallurgica Sinica,Vol.48(2012)1042.
3. H.T. Chen, J. Li, M.Y. Li, Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress, Journal of Alloys and Compounds, Vol.540(2012)32.
4. H.T. Chen, J. Han, J. Li, M.Y. Li, Inhomogeneous Deformation and Microstructure Evolution of Lead-free Solder Interconnects during Thermal Cycling and Shear Testing, Microelectronics Reliability, Vol. 52(2012)1112.
5. H.T. Chen, L. Wang, J. Han, M.Y. Li, H. Liu, Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress, Microelectronic Engineering, Vol.96 (2012) 82.
6. J. Han, H.T. Chen, M.Y. Li, The role of crystal orientation in the failure of Sn3.0Ag0.5Cu solder joints under thermomechanical fatigue, Acta Metallurgica Sinica (English Letters), Acta Metall. Sin.(Engl. Lett.), Vol.25(2012)214.
7. J. Li, M. Turunen, S. Niiranen, H. Chen, M. Paulasto-krockel, A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive, Microelectronics Reliability, 52(2012)2962.
8. H.T. Chen, M. Mueller, T.T. Mattila, J. Li, X.W. Liu, K.-J. Wolter, M.
Paulasto, Localized Recrystallization and Cracking of Lead-Free Solder Interconnections under Thermal Cycling, J. Mater. Res., Vol. 26 (2011) 2103.
9. H.T. Chen, L. Wang, J. Han, M.Y. Li, Q.B. Wu, Grain orientation evolution and deformation behaviors in Pb-free solder interconnects under mechanical stresses, Journal of Electronic Materials, Vol.40 (2011) 2445.
10. H.T. Chen, J. Han, M.Y. Li, Localized recrystallization induced by subgrain rotation in Sn3.0Ag0.5Cu ball grid array solder interconnects during thermal cycling, Journal of Electronic Materials, Vol.40 (2011) 2470.
11. J. Li, H. Xu, J. Hokka, T. T. Mattila, H.T. Chen, M. Paulasto-Kröckel, Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests, Soldering and Surface Mount Technology. vol.23(3),(2011) 161-167.
12. H.B. Xu, M.Y. Li, H.T. Chen, Y.G. Fu, and L. Wang, Lead-free bumping using an alternating electromagnetic field, Journal of Electronic Materials, Vol. 36, No. 1, (2009) 33-39.
13. H. Chang, H.T. Chen, M.Y. Li, L. Wang, Y.G. Fu, Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water, Journal of Electronic Materials, vol.38, No. 10, (2009) 2170-2178.
14. H.T. Chen*, C.Q. Wang, Cheng.Y, and Y. Huang, Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints, Journal of Electronic Materials, Vol. 36, No. 1, (2007) 26-32.
15. H.T. Chen*, C.Q. Wang, Cheng.Y, M.Y. Li, and Y. Huang, Cross-interaction of interfacial reactions in Ni (AuNiCu)-SnAg-Cu solder joints during reflow soldering and thermal aging, Journal of Electronic Materials, Vol. 36, No. 1, (2007) 33-39.
16. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging, Materials Letters, 60 (2006) 1669–1672.
17. H.T. Chen*, C.Q. Wang, M.Y. Li, Y.H. Tian, Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability, Journal of Materials Science and Technology, Vol.21 No. 3 (2005) 419-422.
18. H.T. Chen*, C.Q. Wang, and M.Y. Li, Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling, Microelectronics Reliability, 46 (2006) 1348–1356.
19. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Effect of thermal aging on the microstructure evolution and solder joint reliability in hard disk drive under mechanical shock, IEEE Transactions on Component and Packaging Technology, Vol.31 Issue.4 (2008) 831-836.
20. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization, Journal of Materials Science and Technology, Vol.23 No. 1 (2007) 68-72.
CONFERENCE PAPERS/TALKS
 
TEACHING/SUPERVISING EXPERIENCE
Updated:2019-01