LI Mingyu
Address:
Room 406B, D Buld., HIT Campus, Shenzhen University Town (518055)
Email:
myli@hit.edu.cn
Phone:
0755-26033463
0755-26033504(Fax)
PERSONAL PROFILE
 
RESEARCH INTEREST
 
Printed electronics, Micro/nano joining, Electronic packaging materials, Special brazing
EDUCATION  
1989.09–1993.07
Harbin Institute of Technology, Bachelor
1993.09-1996.01
Harbin Institute of Technology, Master
1997.09-2001.01
Harbin Institute of Technology, Ph. D.
RESEARCH & WORK EXPERIENCE  
1996.04-1998.03
Harbin Institute of Technology, Assistant
1998.04-2003.03
Harbin Institute of Technology, Lecturer
2003.04-2004.03
Harbin Institute of Technology, Associate Professor
2004.04-2006.11
HIT Shenzhen Graduate School, Associate Professor
2006.12-Present
HIT Shenzhen Graduate School, Professor
2001.05-2002.03
Osaka University, Japan, Research fellow
2002.04-2003.03
Chosun University, Korea, Post doctoral Research fellow
PROFESSIONAL QUALIFICATION & ACADEMIC SERVICE
 
2009-Present
Senior member, Chinese electronic society
RESEARCH PROJECTS
2015-2016
Al surface modification via ultrasonic soldering
2015-2016
Ag Nano particles sintering for printed electronics
2015-2017
Ultrasonic assisted brazing
2012-2015
Sn based soldering
RESEARCH ACHIEVEMENT & AWARDS
1998
2011
2014
PATENT
   
1、Laser induced ultrasonic fluxless soldering, ZL00129114.9, China
2、A solder reflow method by electromagnetic radiation, ZL200310107723.3, China
3、Room temperature bonding for area array packaging, ZL200810168269.5, China
PAPER & BOOK PUBLICATIONS
Total 70 SCI papers are published.
1、Li, Mingyu, Li, Zhuolin, Xiao, Yong, Wang, Chunqing. Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature ,Applied Physics Letters,2013,102(9).
2、Wang, Shuai, Li, Mingyu, Ji, Hongjun, Wang, Chunqing. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging ,Scripta
Materialia,2013,69(11-12):789-792.
3、Li, M. Y., Zhang, Z. H., Kim, J. M. Polymorphic transformation mechanism of eta and eta ' in
single crystalline Cu6Sn5 ,Applied Physics Letters,2011,98(20).
4、Zhang, Z. H., Cao, H. J., Li, M. Y., Wang, Y., Liu, Z. Q. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing ,Journal of Applied Physics,2014,116(5)
5、Li, Zhuolin ,Li, Mingyu ,Xiao, Yong,Wang, Chunqing ,Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves ,Ultrasonics Sonochemistry,2014,21(3):924-929.
CONFERENCE PAPERS/TALKS
 
1.Sintered joint of silver nano-pastes at low temperature. 2014 International Conference on Brazing, Soldering and Special Joining Technologies, June 9-13, 2014, Beijing, China(Invited)
2.Synthetic of Cu6Sn5 single-crystal film on Cu substrate for under-bump metallization. International Symposium on Interfacial Joining and Surface Technology, Nov. 27-29, 2013, Osaka, Japan(Invited)
3.Recent advances in anisotropic growth of interfacial Cu6Sn5 phase: Evidence, kinetic mechanism and service reliability issue. International Welding/Joining Conference, May 8-11, 2012, Jeju, Korea(Invited)
TEACHING/SUPERVISING EXPERIENCE
Shool of Materials Science and Engineering, Harbin Institute of Technology
Hongjun Ji, Doctoral candidate, 2006-2009, MSE. from Harbin Institute of Technology
Hongbo Xu, Doctoral candidate, 2007-2010, MSE. from Harbin Institute of Technology
Jing Han, Doctoral candidate, 2008-2012, MSE. from Harbin Institute of Technology
Ming Yang, Doctoral candidate, 2009-2012, MSE. from Harbin Institute of Technology
Zhihao Zhang, Doctoral candidate, 2009-2012, MSE. from Harbin Institute of Technology
Zhuolin Li, Doctoral candidate, 2009-2014, MSE. from Harbin Institute of Technology
Ling Wang, Doctoral candidate, 2010-2014, MSE. from Hunan University
Shuai Wang, Doctoral candidate, 2010-2014, MSE. from Harbin Institute of Technology
Yong Xiao, Doctoral candidate, 2010-2014, MSE. from Harbin Institute of Technology
Updated:2017-10